Features
- Fine line and fine pitch
- Multiple surface finish
- High layer counts
- Multiful via structure for better thermal & electrical performance
- Tight layer to layer alignment
Specification
- Package Solution: BGA, LGA, Flip Chip, Hybrid, etc.
- Surface Finish: Soft Au, ENEPIG, ENIG, SOP, OSP
- Impedance control for critical signal traces
- Enhanced thermal performance
